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Home Office Hardware

HP Z6 G4 DDR4-SDRAM 4114 Tower Intel® Xeon® 32 GB 256 GB SSD Windows 10 Pro for Workstations Workstation Black

EAN: 0192018530638
Part number: 2WU46EA
₵32,992.09 net
₵37,281.06 gross
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HP Z6 G4 DDR4-SDRAM 4114 Tower Intel® Xeon® 32 GB 256 GB SSD Windows 10 Pro for Workstations Workstation Black

EAN:

0192018530638

Part number:

2WU46EA

Processor manufacturer: Intel
Processor model: 4114
Processor family: Intel® Xeon®
Processor cores: 10
Processor boost frequency: 3 GHz
Processor frequency: 2.2 GHz
Processor socket: LGA 3647 (Socket P)
Processor cache: 13.75 MB MB
Processor cache type: L3
Processor threads: 20
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Description
Read more about HP Z6 G4 DDR4-SDRAM 4114 Tower Intel® Xeon® 32 GB 256 GB SSD Windows 10 Pro for Workstations Workstation Black
Specifications
Processor
The manufacturer that produced the processor.  Processor manufacturer Intel  
The model number for the processor in a computer.  Processor model 4114  
A family of processors is a group of processors produced by one company over a short period of time e.g. Intel Pentium processors.  Processor family Intel® Xeon®  
The number of central processing units ('cores') in a processor. Some processors have 1 core, others have 2 (e.g. Intel Core Duo) or more (e.g. the Intel Xeon E7-2850 has 10 cores).  Processor cores 10  
The turbo boost is an automatic, managed accelleration of the processor when one of the cores is overloaded.  Processor boost frequency 3 GHz  
The speed that the microprocessor executes each instruction or each vibration of the clock. The CPU requires a fixed number of clock ticks, or cycles, to execute each instruction. The faster the clocks rate, the faster the CPU, or the faster it can execute instructions. Clock Speeds are usually determined in MHz, 1 MHz representing 1 million cycles per second, or in GHz, 1 GHz representing 1 thousand million cycles per second. The higher the CPU speed, the better a computer will perform.  Processor frequency 2.2 GHz  
Mechanical component(s) that provides mechanical and electrical connections between a microprocessor and a printed circuit board (PCB). This allows the processor to be replaced without soldering.  Processor socket LGA 3647 (Socket P)  
Processor cache 13.75 MB  MB
Processor cache type L3  
Processor threads 20  
Bus type UPI  
The process which is performed by the processor e.g. CPU (Central Processing Unit).  Processor lithography 14 nm  
Operating modes for the processors that place restrictions on the type and scope of operations for certain processes run by the CPU. This design allows the operating system to run with more privileges than application software.  Processor operating modes 64-bit  
Thermal Design Power (TDP) 85 W  
Processor codename Skylake  
Tcase 78 °C  
PCI Express slots version 3.0  
Maximum number of PCI Express lanes 48  
Number of processors in the product.  Number of processors installed 1  
Stepping U0  
Maximum internal memory supported by processor 768 GB  GB
Memory types supported by processor DDR4-SDRAM  
Memory clock speeds supported by processor 2400 MHz  MHz
ECC supported by processor Yes  
Memory
The type of internal memory such as RAM, GDDR5.  Internal memory type DDR4-SDRAM  
A computer's memory which is directly accessible to the CPU.  Internal memory 32 GB  GB
The maximum internal memory which is available in the product.  Maximum internal memory 384 GB  GB
The slots and size of the memory for the CPU.  Memory layout (slots x size) 2 x 16 GB  GB
Number and type of memory expansion slots, including connector and memory module descriptions.  Memory slots 12x DIMM  
The frequency at which the memory (e.g. RAM) runs.  Memory clock speed 2666 MHz  MHz
ECC means Error Correction Code, and it is memory that is able to detect and correct some memory errors without user intervention.  ECC Yes  
Memory channels Hexa-channel  
Storage
The total amount of data that can be stored on the device.  Total storage capacity 256 GB  GB
Used for the storage of date e.g. HDD (hard disk drive), SSD (solid-state drive).  Storage media SSD  
Total SSDs capacity 256 GB  GB
Number of SSDs installed 1  
The Solid State Drive's data storage capacity.  SSD capacity 256 GB  GB
The type of interface(s) with which the Solid State Drive is connected to other hardware.  SSD interface PCI Express  
Graphics
Discrete graphics card No  
A graphics adapter (often known as a video card) generates images for a display. A discrete graphics adapter plugs into the motherboard, and usually produces much better graphics than an integrated graphics adapter. There are various models of discrete graphics adapters.  Discrete graphics card model Not available  
Network
An Ethernet LAN (Local Area Network) interface is present, for a wired conection via a cable.  Ethernet LAN Yes  
The different speed levels of the Ethernet LAN connection.  Ethernet LAN data rates 10,100,1000 Mbit/s  Mbit/s
Type of cable technology performance.  Cabling technology 10/100/1000Base-T(X)  
Popular technology that allows an electronic device to exchange data or connect to the internet wirelessly using radio waves.  Wi-Fi No  
Ports & interfaces
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity 10  
Number of USB 3.0 (3.1 Gen 1) ports with Type-C connector. USB 3.0 (3.1 Gen 1) is USB interface version which supports transfer rate up to 5 Gbit/s (SuperSpeed). USB Type-C connector has symmetrical design architecture and compatible with Thunderbolt 3 interface.  USB 3.2 Gen 1 (3.1 Gen 1) Type-C ports quantity 1  
Number of USB 3.1 (3.1 Gen 2) ports with Type-C connector. USB 3.1 (3.1 Gen 2) is USB interface version which supports transfer rate up to 10 Gbit/s (SuperSpeed+). USB Type-C connector has symmetrical design architecture and compatible with Thunderbolt 3 interface.  USB 3.2 Gen 2 (3.1 Gen 2) Type-C ports quantity 2  
The number of PS/2 connectors for keyboards and mice. Its name comes from the IBM Personal System/2.  PS/2 ports quantity 2  
Number of Ethernet LAN (RJ-45) ports (connecting interfaces) in the device. Ethernet LAN (RJ-45) ports allow a computer to connect to the ethernet.  Ethernet LAN (RJ-45) ports 2  
The socket where a microphone is connected to the device.  Microphone in No  
Line-in Yes  
Line-out Yes  
Combo headphone/mic port Yes  
Expansion slots
PCI Express x4 slots 3  
PCI Express x8 slots 1  
PCI Express x16 slots 2  
Design
The type of rigid framework onto which is the hosuing for device components.  Chassis type Tower  
A drive bay is a standard-area for adding hardware to a computer. Most drive bays are fixed to the inside of a case, but some can be removed. A 3.5" drive bay is for floppy disks.  Number of 3.5" bays 2  
A drive bay is a standard-area for adding hardware to a computer. Most drive bays are fixed to the inside of a case, but some can be removed. A 5.25" drive bay, also known as full-height bays, were found in old PCs in the early to mid-1980s. They were 3¼″ high by 5¾″ wide, and up to 8″ deep (83 × 146 × 200 mm), used mainly for hard disks and floppy disk drives.  Number of 5.25" bays 2  
The colour e.g. red, blue, green, black, white.  Product colour Black  
Country where the device is made. Aka Country of manufacture (COM).  Country of origin China  
Performance
Audio chip Realtek ALC221  
The sub-category of the product.  Product type Workstation  
Software
Type of operating system on a device e.g. IOS on Apple devices, Android for mobile devices.  Operating system installed Windows 10 Pro for Workstations  
Drivers included Yes  
Processor special features
Supported instruction sets AVX,AVX 2.0,AVX-512,SSE4.2  
Processor code SR3GK  
<b>Added Security with Faster Data Encryption</b> The Intel® Advanced Encryption Standard New Instructions (Intel® AES-NI) enable fast and secure data encryption and decryption for better performance and less risk from timing and cache-based attacks than table-based software implementations. Intel AES-NI supports usages such as standard key lengths, standard modes of operation, and even some nonstandard or future variants.  Intel® AES New Instructions (Intel® AES-NI) Yes  
Enhanced Intel SpeedStep Technology Yes  
Execute Disable Bit Yes  
Intel Trusted Execution Technology Yes  
Scalability 2S  
Intel VT-x with Extended Page Tables (EPT) Yes  
Embedded options available No  
Intel TSX-NI Yes  
Intel 64 Yes  
<b>Simplify Virtualization and Reduce Overheads</b> Intel® Virtualization Technology (Intel® VT) helps make virtualization practical by eliminating performance overheads, reducing complexity, and improving security with hardware assistance. Virtualization allows multiple workloads to share a common set of resources so that a variety of workloads can co-locate while maintaining full isolation from each other.  Intel Virtualization Technology for Directed I/O (VT-d) Yes  
<b>Simplify Virtualization and Reduce Overheads</b> Intel® Virtualization Technology (Intel® VT) helps make virtualization practical by eliminating performance overheads, reducing complexity, and improving security with hardware assistance. Virtualization allows multiple workloads to share a common set of resources so that a variety of workloads can co-locate while maintaining full isolation from each other.  Intel Virtualization Technology (VT-x) Yes  
Intel TSX-NI version 1.00  
Processor package size 76.0 x 56.5 mm  
Processor ARK ID 123550  
<b>Higher Performance When You Need It Most</b> Intel® Turbo Boost Technology 2.0 accelerates processor and graphics performance by increasing the operating frequency when operating below specification limits. The maximum frequency varies depending on workload, hardware, software, and overall system configuration.  Intel® Turbo Boost Technology 2.0  
<b>Improved Performance for Threaded Software</b> Intel® Hyper-Threading Technology (Intel® HT Technology) makes efficient use of processor resources, enabling multiple threads to run on each core and increasing processor throughput. Available on Intel® Core™ and Intel® Xeon® processors, Intel HT Technology helps run demanding applications simultaneously, protect and manage systems, and provide headroom for business growth.  Intel® Hyper Threading Technology (Intel® HT Technology) Yes  
Conflict free means "DRC conflict free", which is defined by the U.S. Securities and Exchange Commission rules to mean products that do not contain conflict minerals (tin, tantalum, tungsten and/or gold) that directly or indirectly finance or benefit armed groups in the Democratic Republic of the Congo (DRC) or adjoining countries.  Conflict-Free processor Yes  
Weight & dimensions
The measurement or extent of something from side to side.  Width 169 mm  
The distance from the front to the back of something.  Depth 465 mm  
The measurement of the product from head to foot or from base to top.  Height 445 mm  
Weight of the product without packaging (net weight). If possible, the net weight is given including standard accessories and supplies. Please note that sometimes the manufacturer leaves out the weight of accessories and/or supplies.  Weight 13.1 kg  
Packaging content
This product includes a display.  Display included No  
Manual Yes  

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2WU46EA

2WU46EA
HP Z6 G4 DDR4-SDRAM 4114 Tower Intel® Xeon® 32 GB 256 GB SSD Windows 10 Pro for Workstations Workstation Black

Your personal data will be administered by Senetic Limited with its registered office in 7th Floor, Mulliner Towers, 39 Alfred Rewane Road, Ikoyi, Lagos, Nigeria. You have the right to demand access to personal data and to rectify, erase or limit the processing, as well as to object to the processing. Detailed information on the processing of personal data can be found in the privacy policy.
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