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PER540PLM03

Product name: DELL PowerEdge R540 server 2.4 GHz 32 GB Rack (2U) Intel Xeon Silver 495 W DDR4-SDRAM
EAN: 5902002116046
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₵12,279.66 net
₵13,876.02 gross
Availability:
11-20  pcs
Delivery:
1
1 2 3 4 5 6 7 8 9+
Description
Read more about DELL PowerEdge R540 server 2.4 GHz 32 GB Rack (2U) Intel Xeon Silver 495 W DDR4-SDRAM
Specifications
Processor
The manufacturer that produced the processor.  Processor manufacturer Intel  
The model number for the processor in a computer.  Processor model 4210R  
The speed that the microprocessor executes each instruction or each vibration of the clock. The CPU requires a fixed number of clock ticks, or cycles, to execute each instruction. The faster the clocks rate, the faster the CPU, or the faster it can execute instructions. Clock Speeds are usually determined in MHz, 1 MHz representing 1 million cycles per second, or in GHz, 1 GHz representing 1 thousand million cycles per second. The higher the CPU speed, the better a computer will perform.  Processor frequency 2.4 GHz  
The turbo boost is an automatic, managed accelleration of the processor when one of the cores is overloaded.  Processor boost frequency 3.2 GHz  
A family of processors is a group of processors produced by one company over a short period of time e.g. Intel Pentium processors.  Processor family Intel Xeon Silver  
The number of central processing units ('cores') in a processor. Some processors have 1 core, others have 2 (e.g. Intel Core Duo) or more (e.g. the Intel Xeon E7-2850 has 10 cores).  Processor cores 10  
Processor cache 13.75 MB  MB
Number of processors in the product.  Number of processors installed 1  
Thermal Design Power (TDP) 85 W  
Mechanical component(s) that provides mechanical and electrical connections between a microprocessor and a printed circuit board (PCB). This allows the processor to be replaced without soldering.  Processor socket LGA 3647 (Socket P)  
The process which is performed by the processor e.g. CPU (Central Processing Unit).  Processor lithography 14 nm  
Processor threads 20  
Operating modes for the processors that place restrictions on the type and scope of operations for certain processes run by the CPU. This design allows the operating system to run with more privileges than application software.  Processor operating modes 64-bit  
Processor codename Cascade Lake  
Tcase 78 °C  
Maximum internal memory supported by processor 1024 GB  GB
Memory types supported by processor DDR4-SDRAM  
Memory clock speeds supported by processor 2400 MHz  MHz
Execute Disable Bit Yes  
Maximum number of PCI Express lanes 48  
Processor package size 76.0 x 56.5 mm  
Supported instruction sets AVX-512  
Scalability 2S  
Embedded options available Yes  
Memory
A computer's memory which is directly accessible to the CPU.  Internal memory 32 GB  GB
Buffered memory type Registered (buffered)  
Memory ranking 2  
The type of internal memory such as RAM, GDDR5.  Internal memory type DDR4-SDRAM  
Number and type of memory expansion slots, including connector and memory module descriptions.  Memory slots 16 x RDIMM  
The frequency at which the memory (e.g. RAM) runs.  Memory clock speed 3200 MHz  MHz
The slots and size of the memory for the CPU.  Memory layout (slots x size) 1 x 32 GB  GB
Memory data transfer rate 3200 MT/s  
The maximum internal memory which is available in the product.  Maximum internal memory 320 GB  GB
Storage
The total amount of data that can be stored on the device.  Total storage capacity 480 GB  GB
The total number of hard drives that can be used in/with this product.  Number of HDDs supported 12  
The size of the hard disk drives which can be used by the device.  Supported HDD sizes 3.5"  "
Number of SSDs installed 1  
The Solid State Drive's data storage capacity.  SSD capacity 480 GB  GB
The type of interface(s) with which the Solid State Drive is connected to other hardware.  SSD interface Serial ATA  
SSD size 2.5"  
The device uses RAID, which is a storage technology that combines multiple disk drive components into a logical unit for the purposes of data redundancy and performance improvement. Data is distributed across the drives in one of several ways, referred to as RAID levels, depending on the specific level of redundancy and performance required.  RAID support No  
Supported RAID controllers PERC H730P 2GB  
An optical drive uses laser to read optical discs such as CDs, DVDs and Blu-Ray. Some types of optical drive are: CD ROM drive, CR-RW (CD writer) drive, DVD-ROM.  Optical drive type No  
Supported storage drive interfaces SAS, Serial ATA  
Network
An Ethernet LAN (Local Area Network) interface is present, for a wired conection via a cable.  Ethernet LAN Yes  
Type of cable technology performance.  Cabling technology 10/100/1000Base-T(X)  
Ethernet interface type Gigabit Ethernet  
Ports & interfaces
Number of Ethernet LAN (RJ-45) ports (connecting interfaces) in the device. Ethernet LAN (RJ-45) ports allow a computer to connect to the ethernet.  Ethernet LAN (RJ-45) ports 2  
Number of USB 2.0 ports (connecting interfaces) in the device. USB 2.0 was released in April 2000 (now called "Hi-Speed"), adding higher maximum signaling rate of 480 Mbit/s (effective throughput up to 35 MB/s or 280 Mbit/s), USB 2.0 ports are usually black.  USB 2.0 ports quantity 1  
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity 2  
Number of VGA (D-Sub) ports (connecting interfaces) in the device. The VGA (D-Sub) connector is a 15 pin connector between a computer and a monitor. It was first introduced in 1987 by IBM.  VGA (D-Sub) ports quantity 2  
The number of serial ports in a computer or peripheral. A serial port is a serial communication physical interface through which information transfers in or out one bit at a time. The term "serial port" usually identifies hardware more or less compliant to the RS-232 standard, intended to interface with a modem or with a similar communication device. In modern computers and peripherals, serial ports have largely been replaced by USBs and other interfaces.  Serial ports quantity 1  
Power cables quantity 2  
Expansion slots
PCI Express slots version 3.0  
Design
The type of rigid framework onto which is the hosuing for device components.  Chassis type Rack (2U)  
The colour e.g. red, blue, green, black, white.  Product colour Black  
The type of mounting that can position devices in a shelving system (rack).  Rack mounting Yes  
Redundant fans support Yes  
Rack rails Yes  
Bezel Yes  
Performance
Remote administration iDRAC9 Enterprise  
Performance management OpenManage Enterprise Advanced  
Software
Type of operating system on a device e.g. IOS on Apple devices, Android for mobile devices.  Operating system installed No  
List of desktop operating systems tested as compatible with this product.  Compatible operating systems - Canonical Ubuntu LTS - Citrix XenServer - Microsoft Windows Server with Hyper-V - Red Hat Enterprise Linux - SUSE Linux Enterprise Server - VMware ESXi  
Processor special features
Enhanced Intel SpeedStep Technology Yes  
<b>Simplify Virtualization and Reduce Overheads</b> Intel® Virtualization Technology (Intel® VT) helps make virtualization practical by eliminating performance overheads, reducing complexity, and improving security with hardware assistance. Virtualization allows multiple workloads to share a common set of resources so that a variety of workloads can co-locate while maintaining full isolation from each other.  Intel Virtualization Technology for Directed I/O (VT-d) Yes  
<b>Improved Performance for Threaded Software</b> Intel® Hyper-Threading Technology (Intel® HT Technology) makes efficient use of processor resources, enabling multiple threads to run on each core and increasing processor throughput. Available on Intel® Core™ and Intel® Xeon® processors, Intel HT Technology helps run demanding applications simultaneously, protect and manage systems, and provide headroom for business growth.  Intel® Hyper Threading Technology (Intel® HT Technology) Yes  
<b>Higher Performance When You Need It Most</b> Intel® Turbo Boost Technology 2.0 accelerates processor and graphics performance by increasing the operating frequency when operating below specification limits. The maximum frequency varies depending on workload, hardware, software, and overall system configuration.  Intel® Turbo Boost Technology 2.0  
<b>Added Security with Faster Data Encryption</b> The Intel® Advanced Encryption Standard New Instructions (Intel® AES-NI) enable fast and secure data encryption and decryption for better performance and less risk from timing and cache-based attacks than table-based software implementations. Intel AES-NI supports usages such as standard key lengths, standard modes of operation, and even some nonstandard or future variants.  Intel® AES New Instructions (Intel® AES-NI) Yes  
Intel Trusted Execution Technology Yes  
Intel VT-x with Extended Page Tables (EPT) Yes  
Intel TSX-NI Yes  
Intel 64 Yes  
<b>Simplify Virtualization and Reduce Overheads</b> Intel® Virtualization Technology (Intel® VT) helps make virtualization practical by eliminating performance overheads, reducing complexity, and improving security with hardware assistance. Virtualization allows multiple workloads to share a common set of resources so that a variety of workloads can co-locate while maintaining full isolation from each other.  Intel Virtualization Technology (VT-x) Yes  
Processor ARK ID 193384  
Power
The way in which the product is powered e.g. rechargeable battery, mains electricity connected via a plug and cable.  Power supply 495 W  
Additional power supply which can run a computer if the main power supply fails.  Redundant power supply (RPS) support Yes  
Number of redundant power supplies installed 2  
Operational conditions
The minimum and maximum temperatures at which the product can be safely operated.  Operating temperature (T-T) 10 - 35 °C  
The minimum and maximum temperatures at which the product can be safely stored.  Storage temperature (T-T) -40 - 65 °C  
Operating relative humidity (H-H) 10 - 80%  
Storage relative humidity (H-H) 5 - 95%  
Operating altitude 0 - 3048 m  
Non-operating altitude 0 - 12000 m  
Weight & dimensions
The measurement of the product from head to foot or from base to top.  Height 86.8 mm  
The distance from one side of the packaging to the other.  Package width 918 mm  
The distance from the front to the back of the packaging.  Package depth 614 mm  
The distance from the top to the bottom of the packaging.  Package height 284 mm  
Weight of the packaged product.  Package weight 34 kg  
Packaging content
Cables included AC  

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